Shinkou Manufacturing's Technology Development
Providing build-up substrates using ultra-thin materials, laser vias, and via stack technology!
Shinko Manufacturing Co., Ltd. supplies products that satisfy our customers through technological development. We provide build-up substrates using ultra-thin materials, laser vias, via-fill plating, and via-stack technology. We have a proven track record in mass production of double-sided printed circuit boards, multilayer printed circuit boards, LED circuit boards, cavity printed circuit boards, and build-up printed circuit boards. 【Mass Production Achievements】 ■ Double-sided printed circuit boards ■ Multilayer printed circuit boards ■ LED circuit boards ■ Cavity printed circuit boards ■ Build-up printed circuit boards ■ Thin high-density printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.
- Company：伸光製作所
- Price：Other
